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Title:
METHOD FOR GRINDING OPTICAL DEVICE WAFER
Document Type and Number:
Japanese Patent JP2011086803
Kind Code:
A
Abstract:

To provide a method for grinding an optical device wafer which can thin the optical device wafer configured by laminating an optical device on the surface of a sapphire substrate without damaging the wafer.

The method for grinding the optical device wafer configured by forming the optical device on the surface of the sapphire substrate includes: an outer peripheral surface grinding process for grinding the outer peripheral surface of the optical device wafer from the rear side to the surface side at a predetermined diameter expansion angle like a conical surface; and a rear grinding process for grinding the rear face of the optical device wafer subjected to the outer peripheral surface grinding processing to grind the wafer up to a predetermined thickness.


Inventors:
Umeda, Yoshio
Ikehata, Hisataka
Application Number:
JP2009000239176
Publication Date:
April 28, 2011
Filing Date:
October 16, 2009
Export Citation:
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Assignee:
DISCO ABRASIVE SYST LTD
International Classes:
H01L21/304; B24B7/00; B24B9/00; H01L33/02
Domestic Patent References:
2007-12-27
2003-09-02
2004-12-24
2005-09-15