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Patent Searching and Data


Title:
METHOD FOR HEAT-TREATING BELYLLIUM COPPER ALLOY
Document Type and Number:
Japanese Patent JPH03260041
Kind Code:
A
Abstract:

PURPOSE: To prevent the coarsening of the recrystallized structure in a beryllium copper alloy in a heating stage in soln. treatment by executing preheating under specified conditions before subjecting a plastic working material of a beryllium copper alloy having a specified compsn. to soln. treatment.

CONSTITUTION: A plastic working material of a beryllium copper alloy consisting essentially of, by weight, 1.6 to 2.0% Be and 0.2 to 0.6% (Co+N) and the balance Cu is subjected to preheating in the temp. range of 500 to 650°C for ≥1hr (about ≤20hr) before heating it to ≥700°C and executing soln. treatment or again executing hot working. In this way, at the time of heating the material to ≥700°C for soln. treatment or the like, the coarsening of its recrystallized structure can be prevented and its structure can be formed into a uniform and fine crystalline one having about ≤2mm average grain size, by which a beryllium copper alloy material satisfying the reliability in mechanical characteristics and ultrasonic flaw detecting properties can be obtd.


Inventors:
ISHIHARA TOSHIAKI
YAMAMOTO KAZUHIRO
Application Number:
JP5934290A
Publication Date:
November 20, 1991
Filing Date:
March 09, 1990
Export Citation:
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Assignee:
NGK INSULATORS LTD
International Classes:
C22F1/08; C22F1/00; (IPC1-7): C22F1/08
Attorney, Agent or Firm:
Akio Najima (2 others)