To provide a method of heating a substrate by which the uniformity of a film between substrates can be improved during heating by carrying in a plurality of substrates one by one into a processing chamber.

The temperature of substrates to be carried in one by one into a processing chamber is monitored (1), the quantity of heat storage to the processing chamber is estimated on the basis of the aging of the substrates (2), and the heating time of the substrate in the processing chamber, especially film formation times (B1, B2, B3, etc.) are controlled on the basis of the estimated quantity of the heat storage so that the quantity of heat to be supplied per substrate may be constant (3). Thus, a change can be prevented in film thickness due to heat storage in the processing chamber.