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Title:
METHOD FOR HYBRIDIZING SELECTIVE BONDING SUBSTANCE, HYBRIDIZATION APPARATUS, AND SUBSTRATE FOR ARRANGING SELECTIVE BONDING SUBSTANCE
Document Type and Number:
Japanese Patent JP2003202343
Kind Code:
A
Abstract:

To provide an efficient hybridization apparatus of a simple structure capable of shortening reaction time of a selectively bonding substance.

On a substrate, the selective bonding substance is arranged in a region for arranging the selective bonding substance. A sample solution to be tested, which contains a corresponding selective bonding substance which selectively bonds to the selective bonding substance, is brought into action to hybridize the selective bonding substance and the corresponding selective bonding substance in a process. The method for hybridizing the selective bonding substance comprises a process for impressing an A.D. voltage between conductive electrodes arranged outside both ends of the region for arranging the selective bonding substance in a direction which intersects a vertical axis of a plane for arranging the selective bonding substance in the hybridization process.


Inventors:
HIKASA MASAFUMI
NAGINO KUNIHISA
Application Number:
JP2002309434A
Publication Date:
July 18, 2003
Filing Date:
October 24, 2002
Export Citation:
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Assignee:
TORAY INDUSTRIES
International Classes:
G01N33/53; C12M1/00; C12M1/40; C12N15/09; G01N37/00; (IPC1-7): G01N33/53; C12M1/00; C12M1/40; C12N15/09; G01N37/00