Title:
基材への含浸方法
Document Type and Number:
Japanese Patent JP4174293
Kind Code:
B2
Inventors:
松▲崎▼ 義則
Hideo Fujinaka
Hideo Fujinaka
Application Number:
JP2002313394A
Publication Date:
October 29, 2008
Filing Date:
October 28, 2002
Export Citation:
Assignee:
MATSUSHITA ELECTRIC WORKS,LTD.
International Classes:
B29B15/10; C08J5/24; B29K105/08
Domestic Patent References:
| JP595028A | ||||
| JP5567412A | ||||
| JP62156138A | ||||
| JP6456737A | ||||
| JP56161121A | ||||
| JP5530930A | ||||
| JP63199612A | ||||
| JP61141961A |
Attorney, Agent or Firm:
Keisei Nishikawa
Atsuo Mori
Atsuo Mori