Title:
METHOD FOR IMPROVING ADHESION OF POLYPHENYLENE ETHER RESIN TO METAL FILM
Document Type and Number:
Japanese Patent JPH11335550
Kind Code:
A
Abstract:
To provide a method for improving adhesion between a conductive layer of a laminate and a substrate material.
In a suitable embodiment, the conductive layer of the laminate is a copper film and the substrate material comprises a polyphenylene ether resin. This method comprises mixing a copolymer of a vinylarom. compd. and an α,β-unsatd. cyclic acid anhydride with a polyphenylene ether resin. Pref., the copolymer of a vinylarom. compd. and an α,β-unsatd. cyclic acid anhydride is a polystyrene-maleic anhydride copolymer or a rubber-modified polystyrene- maleic anhydride copolymer.
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Inventors:
BURNELL ANN M
LUBERA JOHN F
OLIVER TERRENCE P
LUBERA JOHN F
OLIVER TERRENCE P
Application Number:
JP1785799A
Publication Date:
December 07, 1999
Filing Date:
January 27, 1999
Export Citation:
Assignee:
GEN ELECTRIC
International Classes:
B32B15/08; C08K3/00; C08K3/34; C08K5/521; C08L25/08; C08L35/06; C08L51/04; C08L71/12; H05K1/03; H05K3/38; (IPC1-7): C08L71/12; B32B15/08; C08K3/00; C08K3/34; C08K5/521; C08L25/08; C08L35/06; C08L51/04; H05K1/03; H05K3/38
Attorney, Agent or Firm:
Tokunji Ikunuma