Title:
METHOD FOR INSERT MOLDING AND APPARATUS FOR INSERT HOLDING
Document Type and Number:
Japanese Patent JP2001026035
Kind Code:
A
Abstract:
To provide a protective member which can prevent an insert resin from being deformed and broken when injection molding is performed regardless of resin strength and easily perform releasing of the insert resin after a molding resin is cooled.
A thin film coating layer 21 is formed in advance with a polytetrafluoroethylene containing a filler with a low frictional coefficient on the outer peripheral face of an insert material holding part 20a of a protective member 20A arranged on the inside of an insert material 30 and when insert molding is performed, an insert resin 30 is held from the inside through this coating layer 21.
Inventors:
AKIYAMA KENJI
Application Number:
JP19907699A
Publication Date:
January 30, 2001
Filing Date:
July 13, 1999
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
B29C45/26; B29C45/14; B29L23/00; (IPC1-7): B29C45/14; B29C45/26
Attorney, Agent or Firm:
Miyazono Junichi
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