Title:
METHOD FOR INSPECTING CONDUCTIVELY CONNECTING CONTACTS BETWEEN IC SOCKET AND PRINTED BOARD
Document Type and Number:
Japanese Patent JP3667786
Kind Code:
B2
Abstract:
PURPOSE: To inspect soldering state between an IC socket and a board by arranging on a socket body with a resilient member for pushing an IC package mounted on the socket body resiliently from the upper surface thereof and pressing the terminal of the IC package against the contacting part of a pin terminal of the socket body.
CONSTITUTION: An IC package 2 is not mounted directly on a printed board but mounted on an IC socket 1 and then connected through pin terminals 3 thereof with the printed board, so that the IC package 2 can be replaced easily, when the connecting state is rejectable. Because a transparent socket body 1 is employed, soldering state at a land of the printed board can be inspected directly. When a proposition is provided at the land, the protrusion changes color from copper color to solder color and visual inspection can be facilitated.
Inventors:
Shuji Inoue
Kazuhisa Ozawa
Kazuhisa Ozawa
Application Number:
JP7127094A
Publication Date:
July 06, 2005
Filing Date:
March 17, 1994
Export Citation:
Assignee:
INTEL CORPORATION
Enplus Inc.
Enplus Inc.
International Classes:
H01R33/74; H01R33/94; H01R43/00; H05K1/18; H01R33/76; H05K3/34; H05K7/10; (IPC1-7): H05K1/18; H01R33/76; H01R43/00
Domestic Patent References:
| JP1256190A | ||||
| JP3257769A | ||||
| JP3126363U | ||||
| JP5053144U | ||||
| JP1103272U | ||||
| JP58178282U | ||||
| JP50000352B1 | ||||
| JP61072851U | ||||
| JP64051288U | ||||
| JP63060285U |
Attorney, Agent or Firm:
Masaki Yamakawa
Hiroro Kurokawa
Masayuki Konno
Osamu Nishiyama
Shigeki Yamakawa
Hiroro Kurokawa
Masayuki Konno
Osamu Nishiyama
Shigeki Yamakawa