To solve the problem conventionally that inspection method, such as that the frequency of cleaning for a probe increases and the throughput of inspection process as a whole drops, since foreign matters in growing of bumps adhere to the probe in the probe inspection process.

Sine the shape of a tip 12a of the probe 12 is acute and spherical in surface, in the inspection process the tip 12a of the probe 12 can be brought into contact with an Au bump electrode 11 without overdrive amount, so that the quantity of foreign mater in growth of the bump adhering to the probe 12 can be reduced, and also at cleaning of the probe, it is cleaned, using a cleaning sheet capable of surely removing the foreign matters which adhere to the probe, whereby a superior inspection method for a semiconductor device capable of improving the throughput and reducing the inspection cost can be materialized as an inspection method.