To provide a method for inspecting a soldering section in an electronic component which enables an inspection of the soldering section impossible for a conventional image inspecting method, and simultaneously uses an image system and a laser system.

The soldering section is heated by the laser. The quality of the soldering section is determined from a thermal capacity in the soldering section. The quality of the soldering section is determined from a thermal capacity value by comparing the measured thermal capacity value with a reference thermal capacity value of a good sample. The thermal capacity value is calculated from a measurement value of radiation power from a heated section.