Title:
METHOD OF INTERCONNECTING CIRCUIT BY ANISOTROPIC CONDUCTIVE ADHESIVE
Document Type and Number:
Japanese Patent JPH04314386
Kind Code:
A
Abstract:
PURPOSE: To improve the reliability of an anisotropic conductive adhesive.
CONSTITUTION: When a filler 8 made from a magnetic powder is in a magnetized state, after applying an anisotropic conductive adhesive, which is uniformly dispersed in a thermosetting resin, on the surface of a wiring board 4 on which a conductor pattern is formed, a lead terminal of the electronic component which will be attached to conductor pattern is aligned and this lead terminal is pressurized and heated to set the thermosetting resin. This process constitutes the circuit connection method by means of an anisotropic conductive adhesive 9.
Inventors:
WATANABE TAKAKUNI
Application Number:
JP7945591A
Publication Date:
November 05, 1992
Filing Date:
April 12, 1991
Export Citation:
Assignee:
FUJITSU LTD
International Classes:
C09J11/04; C09J9/02; H01B5/16; H05K3/32; (IPC1-7): C09J9/02; C09J11/04; H01B5/16; H05K3/32
Attorney, Agent or Firm:
Sadaichi Igita