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Title:
METHOD FOR JUDGING CUTTING POSITION CORRECTNESS OF LAMINATED SUBSTRATE, AND LAMINATED CERAMICS ELECTRONIC PART
Document Type and Number:
Japanese Patent JPH10275736
Kind Code:
A
Abstract:

To provide a method for judging correctness of cutting position of laminated substrates wherein correctness of laminated substrate's cutting position is confirmed with ease by substrate or laminated body and also to provide a laminated ceramics electronic parts.

At such an internal electrode 2a formation place on a green sheet 7 where cutting is to be made, a partial cut part 9 of the internal electrode 2 following a main part 8 which is a capacity formation part of the internal electrode is provided. Based on the presence of a non-exposed part 10 corresponding to the partial cut part 9 of the internal electrode 2 at the end surface of a laminated body, after cutting of laminated substrate, correctness of cutting position is judged. On the lead-out side of the internal electrode 2, two lead-out parts 2a are formed, and the end part of the two lead-out parts 2a is exposed to an end surface 5a of a laminated body 5, resulting in the interval between two lead-out parts 22 as a non-exposed part or the internal electrode.


Inventors:
KOBAYASHI AKIRA
Application Number:
JP7773897A
Publication Date:
October 13, 1998
Filing Date:
March 28, 1997
Export Citation:
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Assignee:
TDK CORP
International Classes:
H01G4/30; H01L21/66; H01G4/12; H05K3/00; H05K1/02; H05K1/03; H05K3/46; (IPC1-7): H01G4/12; H01G4/12; H01G4/30
Attorney, Agent or Firm:
Shoichi Wakata