Title:
硬化前の複合構造体の内部に導電体を敷設する方法
Document Type and Number:
Japanese Patent JP7017885
Kind Code:
B2
Abstract:
A method for placing electrical conductors interior to a composite structure prior to curing. A laminate stack is formed by assembling one or more composite layers, wherein the composite layers are pre-impregnated with a resin. One or more electrical conductors are placed on at least one of the composite layers prior to curing the laminate stack. One or more electrical insulators is optionally placed in proximity to one or more of the electrical conductors in at least one of the composite layers prior to curing the laminate stack. The laminate stack, including the composite layers, the electrical conductors, and the electrical insulators, is then cured to create the composite structure.
Inventors:
Karl Roy McIver
Deyan Nicky
Arthur Sea Day
Deyan Nicky
Arthur Sea Day
Application Number:
JP2017171273A
Publication Date:
February 09, 2022
Filing Date:
September 06, 2017
Export Citation:
Assignee:
The Boeing Company
International Classes:
B05D5/12; B29C70/40; B32B7/025; B64C1/00; B64D45/02; H01B5/16; H01B13/00; H05F1/00; H05F1/02; H05K9/00
Domestic Patent References:
| JP2012135994A | ||||
| JP5102694A | ||||
| JP62019435A |
Foreign References:
| US20100151214 | ||||
| US20050284232 | ||||
| US5565267 |
Attorney, Agent or Firm:
Minoru Yoshida
Tatsuya Tanaka
Suzuki Yasumitsu
Usui Nao
Fumiaki Doi
Keita Kobuchi
Shintaro Suzuki
Tatsuya Tanaka
Suzuki Yasumitsu
Usui Nao
Fumiaki Doi
Keita Kobuchi
Shintaro Suzuki