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Patent Searching and Data


Title:
METHOD AND MACHINE FOR SOLDERING PRINTED BOARD
Document Type and Number:
Japanese Patent JPH0661638
Kind Code:
A
Abstract:

PURPOSE: To provide a method and a machine for soldering a printed board in which an inert gas atmosphere can be brought about efficiently at a part where the printed board comes into contact with molten solder flow.

CONSTITUTION: The soldering method comprises a first step for transferring a printed board 11, a second step for coating the printed board 11 with organic acid based flux, a third step for transferring the printed board 11 from the second step into an inert gas atmospheric section 38 provided with a molten solder tank 19, and a fourth step for feeding molten solder flows 21, 23 to the printed board 11 in the inert gas atmospheric section 38. This method provides a good solderability while eliminating 'Freon(R)' gas cleaning step from soldering process.


Inventors:
NISHI NAOMI
HOSOYA NAOTO
TANAKA KURAHEI
Application Number:
JP1992000211098
Publication Date:
March 04, 1994
Filing Date:
August 07, 1992
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
B23K1/08; B23K31/02; H05K3/34; (IPC1-7): H05K3/34; B23K1/08
Attorney, Agent or Firm:
Akira Kobiji (2 outside)