To provide a method for machining a material having a high hardness such as a diamond by means of femtosecond laser, and for manufacturing a cutting tool used to separate a semiconductor wafer into chips, and also to provide a method and an apparatus for cutting or separating a semiconductor wafer into chips using this cutting tool.
In this method for machining the cutting tool, a workpiece is fixed on a moving stage, the end of the workpiece is irradiated with femtosecond laser in such a manner that the optical axis of the laser beam is parallel to the vertical axis of the movable stage, and cutting is carried out in a circular-arc shape with a prescribed pitch to form a plurality of cutting blades in the end part. Further, grooves are formed by the cutting tool, and a semiconductor wafer is separated into chips on a deformable mount.
TSUGITA HIROSHI
WATABE AKIRA
CYBER LASER KK
| JPH09188534A | 1997-07-22 | |||
| JP2003025118A | 2003-01-29 | |||
| JP2002154846A | 2002-05-28 | |||
| JPH06151589A | 1994-05-31 | |||
| JPH03236261A | 1991-10-22 | |||
| JP2006123054A | 2006-05-18 |
Kobayashi Yoshinori
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