Title:
METHOD FOR MACHINING TAB TAPE
Document Type and Number:
Japanese Patent JPH07185847
Kind Code:
A
Abstract:
PURPOSE: To facilitate the drilling work of a device hole and a slit as being designed, and to greatly reduce the period of trial production of a TAB tape through the irradiation of the excimer laser beam on the TAB tape material consisting of the polyimide film, the PET film or the like to be used in the TCP(Tape Carrier Pack) for semiconductor IC and LSI.
CONSTITUTION: After the beam size of the excimer laser beam is stopped to an arbitrary value by a variable slit 24 capabe of changing the clearance between the slits 36, 38, a TAB material is irradiated with the stopped excimer laser beam. Before the excimer laser beam is stopped by the variable slit 24, the beam size is formed to the desired section by a forming optical system.
Inventors:
ITO TAKU
NOJIRI HITOSHI
NAGIRA ISAO
OYA TOMONORI
NOJIRI HITOSHI
NAGIRA ISAO
OYA TOMONORI
Application Number:
JP35356193A
Publication Date:
July 25, 1995
Filing Date:
December 28, 1993
Export Citation:
Assignee:
KANEGAFUCHI CHEMICAL IND
HAMAMATSU PHOTONICS KK
HAMAMATSU PHOTONICS KK
International Classes:
B23K26/382; B23K26/00; B23K26/066; H01L21/60; (IPC1-7): B23K26/00; B23K26/00; B23K26/06; H01L21/60
Attorney, Agent or Firm:
Kusumoto Takayoshi