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Patent Searching and Data


Title:
METHOD FOR MANUFACTURING ANNULAR SEAMLESS MOLDING
Document Type and Number:
Japanese Patent JP2009101537
Kind Code:
A
Abstract:

To provide a method for manufacturing an annular seamless molding with bubbles reduced enough at high productivity.

After a mold 1 having a resin film on its peripheral surface is covered directly or through a primer layer with a resin tube 3 for forming the surface layer, the mold is heated while its temperature is controlled partially in the mold axial direction to manufacture the annular seamless molding. Temperature control is carried out to form a temperature gradient so that the temperature of the central part in the mold axial direction is higher than the temperature of one end or temperatures of both ends of the mold.


Inventors:
YAMAZAKI MASARU
HAGIWARA TOSHIHIRO
HARA MASAKI
SHIBATA SEIJI
HIRANO AKIRA
UKAI AKIO
Application Number:
JP2007273340A
Publication Date:
May 14, 2009
Filing Date:
October 22, 2007
Export Citation:
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Assignee:
KONICA MINOLTA BUSINESS TECH
International Classes:
B29D29/00
Attorney, Agent or Firm:
Samejima Mutsumi
Kyousei Tamura
Kitahara Yasuhiro