Title:
METHOD FOR MANUFACTURING CERAMIC CIRCUIT BOARD
Document Type and Number:
Japanese Patent JP3954912
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a method for manufacturing a ceramic circuit board wherein a metal plate is positioned and bonded accurately and firmly to a ceramic substrate.
SOLUTION: The method for manufacturing a ceramic circuit board 6 comprises: a step of preparing a ceramic substrate 1 and a circuit-patterned metal plate 4; a step of forming an active metal braze paste layer 2 by printing a circuit pattern of the metal plate 4 on the ceramic substrate 1 by using an active metal braze paste; a step of applying the active metal braze paste to a part of the active metal braze paste layer 2 for formation of a plurality of protrusions 3; and a step of mounting the metal plate 4 on the active metal braze paste layer 2 with the protrusions 3 in between and of heating them in a non-oxidizing atmosphere for bonding together the ceramic substrate 1 and the metal plate 4 with an active metal braze layer 5 formed by heating and melting the active metal braze paste layer 2 and the protrusions 3. The steps are executed in the mentioned order.
Inventors:
Kenichi Hashimoto
Application Number:
JP2002186864A
Publication Date:
August 08, 2007
Filing Date:
June 26, 2002
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
H05K3/20; H05K3/38; (IPC1-7): H05K3/20
Domestic Patent References:
| JP9283656A | ||||
| JP9148334A | ||||
| JP2163950A | ||||
| JP1161892A | ||||
| JP7202063A | ||||
| JP200257420A |