Title:
METHOD OF MANUFACTURING CERAMIC COMPONENT FOR SEMICONDUCTOR MANUFACTURE AND METHOD OF FITTING THE SAME
Document Type and Number:
Japanese Patent JP2008297136
Kind Code:
A
Abstract:
To provide a method of fitting a ceramic component used under a reduced pressure atmosphere and has small contamination to a processed material and a method of manufacturing the ceramic component for semiconductor manufacturing apparatus in which organic material contamination is small.
The method of fitting the non-contaminated ceramic component for semiconductor manufacturing apparatus in which the ceramic component is fitted to the semiconductor manufacturing apparatus in a state that an amount of carbon detected in a depth of 5 nm from the surface by the measurement in the surface depth direction using the X-ray photoelectron spectroscopy is 5 mass%.
Inventors:
ISHIDA HIRONORI
HARADA TAMOTSU
MATSUO HIROYUKI
HARADA TAMOTSU
MATSUO HIROYUKI
Application Number:
JP2007142479A
Publication Date:
December 11, 2008
Filing Date:
May 29, 2007
Export Citation:
Assignee:
TAIHEIYO CEMENT CORP
NIHON CERATEC CO LTD
NIHON CERATEC CO LTD
International Classes:
C04B35/00; C04B35/10; C04B35/44; C04B35/50; C04B35/565; C04B35/581; C04B41/80
Domestic Patent References:
| JP2005083599A | 2005-03-31 | |||
| JPH11176917A | 1999-07-02 | |||
| JP2004277227A | 2004-10-07 | |||
| JPH05319965A | 1993-12-03 | |||
| JP2002241177A | 2002-08-28 | |||
| JPH08134633A | 1996-05-28 |
Foreign References:
| WO2008044555A1 | 2008-04-17 |