To provide a method for accurately manufacturing a ceramic electronic component without deforming a step, a bottom or the like even when the component has a cavity.

The method for manufacturing the ceramic electronic component includes: a laminating step of inserting a baked material layer 8 having properties lost by baking at a lower temperature than the baking temperature of ceramic into a part to become the bottom of the cavity, laminating a plurality of ceramic green sheets 2 to a laminate; and a baking step of baking the laminate. The method also includes a cutting and processing step of cutting the outer periphery of the part to be an internal space of the cavity of the sheet 2 so as to retain a carrier film in the film supplied in a state in which the sheet 2 is placed. This cutting step is conducted by laser processing.