Title:
METHOD FOR MANUFACTURING CERAMIC ELECTRONIC COMPONENT AND COVER SHEET
Document Type and Number:
Japanese Patent JP2021061289
Kind Code:
A
Abstract:
To provide a method for manufacturing a ceramic electronic component, and a cover sheet which allow a cover layer to be prevented from cracking.SOLUTION: A method for manufacturing a ceramic electronic component comprises: a preparation step of preparing a ceramic laminate which includes a laminate part arranged by alternately laminating a dielectric green sheet containing barium titanate as a main component ceramic, and a metal conductive paste pattern, and a cover sheet containing glass having barium titanate as a main component ceramic, and disposed on an upper face and a lower face in a lamination direction of the laminate part; and a baking step of baking the ceramic laminate. In the cover sheet, an addition amount of the glass to the barium titanate is 0.1 wt% or more and 10 wt% or less. The glass has a glass softening point (Ts) of 900°C or below. The difference (Ts-Tg) between the glass softening point (Ts) of the glass and a glass transition point (Tg) is 300°C or below.SELECTED DRAWING: Figure 1
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Inventors:
INOUE MAKI
Application Number:
JP2019183652A
Publication Date:
April 15, 2021
Filing Date:
October 04, 2019
Export Citation:
Assignee:
TAIYO YUDEN KK
International Classes:
H01G4/30
Attorney, Agent or Firm:
Shuhei Katayama