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Title:
METHOD FOR MANUFACTURING CERAMIC MICROSTRUCTURE ON SUBSTRATE IN WHICH SLURRY IS FILLED UP IN MOLD ON SUBSTRATE TO SOLIDIFY
Document Type and Number:
Japanese Patent JP2010167789
Kind Code:
A
Abstract:

To provide a method for manufacturing a ceramic microstructure on a substrate using a useful composition in order to mold the ceramic microstructure on the substrate.

The method for manufacturing the ceramic microstructure includes: a process in which a mold which has a microstructure surface is provided; a process in which a slurry is filled up between the microstructure surface and a substrate surface so that the slurry which includes: a ceramic powder; an evanescent bonding agent (b) chosen from a material which consists of an acrylate resin and an epoxy resin; a diluting agent (c) which carries out phase separation from the evanescent bonding agent when the evanescent bonding agent solidifies may be substantially filled up into the microstructure surface of the mold; a process in which the slurry is solidified by radiation curing to form a material in a raw condition which adheres to the substrate; and a process which eliminates the mold.


Inventors:
Dillon, Kenneth R.
Moh, Kyung H.
Wood, Thomas E.
Chiu, Raymond C.
King, Vincent W.
Rusin, Richard P.
Hoopman, Timothy L.
Humpal, Paul E.
Application Number:
JP2010000092978
Publication Date:
August 05, 2010
Filing Date:
April 14, 2010
Export Citation:
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Assignee:
3M CO
International Classes:
B28B1/00; H01J9/02; B28B1/14; C03C8/14; C03C8/16; C03C17/04; C04B37/04; H01J9/24; H01J11/02; H01J17/04