微小構造体が実装された回路基板の製造方法

Japanese Patent JP7359272

B2

A method for transferring microstructures, comprising at least the steps of:(i) bonding a plurality of microstructures formed on one surface of a supplier substrate to a silicone-based rubber layer formed on a donor substrate;(ii) separating some or all of the plurality of microstructures from the supplier substrate and transferring the some or all of the plurality of microstructures to the donor substrate through the silicone-based rubber layer to produce the donor substrate having the plurality of microstructures temporality fixed thereon;(iii) washing or neutralizing the donor substrate having the plurality of microstructures temporality fixed thereon;(iv) drying the washed or neutralized donor substrate having the plurality of microstructures temporality fixed thereon; and(v) transferring the dried donor substrate having the plurality of microstructures temporality fixed thereof so that the donor substrate can be subjected to a subsequent step. According to the method, a plurality of steps can be carried out while temporality fixing microstructures on a single donor substrate, and therefore it becomes possible to achieve the transfer of the microstructures with high efficiency without increasing the number of steps.

Takanori Ogawa
Keiji Ohori
Shuhei Ueda
Kazunori Kondo
Toshiyuki Kozai
Nobuaki Matsumoto
Taichi Kitagawa
Kohei Otake
Minoru Kawahara

JP2022150813A

October 11, 2023

September 22, 2022

Click for automatic bibliography generation  

Shin-Etsu Chemical Co., Ltd.

H01L21/60; C08F2/44; C08F290/06; C09J183/04; H01L21/02; H01L21/304

JP2002185039A
JP2017168548A
JP2006140398A
JP2008060608A
JP2010251360A
JP2004021034A
JP2010165754A

WO2019065398A1
US20120299147

Patent Attorney Corporation Eimei International Patent Office

Previous Patent: Virtual space generation device, virtual space generation program, and virtual space generation meth...

Next Patent: Communication devices and computer programs for communication devices