To provide a circuit board which can have a circuit chip mounted thereon and can be easily buried therein accurately by pushing the circuit chip thereinto, and also a method of manufacturing the circuit board.
An unset layer, which can be selectively set before or after a circuit chip is positioned, is provided on an area other than the positioned location of the circuit chip. The unset layer is used as such a soft circuit board sheet as to allow the circuit chip to be buried in the board when the circuit chip positioned on the board is pushed. In the method of manufacturing the circuit board, the circuit chip can be accurately buried in the board, and the circuit board can be manufactured in an easy and convenient manner and have a good accuracy.
NAKABAYASHI MASAHITO
IZUMI TADASHI
| JP2005079276A | 2005-03-24 |