Title:
電子デバイス用回路基板の製造方法
Document Type and Number:
Japanese Patent JP7370192
Kind Code:
B2
Abstract:
To provide a manufacturing method of an electronic device circuit board that suppresses the occurrence of burrs and has excellent workability.SOLUTION: A dividing groove having a substantially flat bottom surface is formed on the back surface of an assembly substrate. Preferably, the bottom of the dividing groove is irradiated with laser light from the main surface side, or a substantially trapezoidal dividing groove that opens toward the main surface is also formed on the main surface.SELECTED DRAWING: Figure 3
Inventors:
Kotetsu Tamura
Shingo Kuriki
Shigeru Suzuki
Shingo Kuriki
Shigeru Suzuki
Application Number:
JP2019150486A
Publication Date:
October 27, 2023
Filing Date:
August 20, 2019
Export Citation:
Assignee:
Citizen Electronics Co., Ltd.
Citizen Watch Co., Ltd.
Citizen Watch Co., Ltd.
International Classes:
H05K1/02; H01L21/301; H05K3/00
Domestic Patent References:
| JP2018116963A | ||||
| JP2016009870A |
Attorney, Agent or Firm:
Patent Attorney Corporation Shuwa Patent Office
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