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Title:
METHOD OF MANUFACTURING COMPOSITE MEMBER, PHOTOSENSITIVE COMPOSITION, INSULATOR FOR MANUFACTURING COMPOSITE MEMBER, THE COMPOSITE MEMBER, MULTILAYERED WIRING BOARD, AND ELECTRONIC PACKAGE
Document Type and Number:
Japanese Patent JP3766288
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To provide a method of manufacturing a composite material, which allows a high flexibility in designing a conductive circuit and allows an easy formation of a conductive section having a fine pattern, without causing deterioration in an insulator.
SOLUTION: The method of manufacturing the composite member comprises (1) a first process of forming on the insulator 1, a photosensitive composition layer 2 containing a chemical which produces or erases ion exchange groups due to irradiation with light of wavelength 280 nm or higher, (2) a second process of exposing the photosensitive composition to exposure light of a wavelength 280 nm or higher using a mask, to produce or erase the ion exchange groups in an exposed part 4, and (3) a third process of enabling metal ions or metals, to bond with a pattern of the ion exchange groups formed by the exposure, using a mask to form the conductive section.


Inventors:
Yasuyuki Hotta
Toshiro Hiraoka
Asakawa Kouji
Shigeru Matake
Application Number:
JP2001096683A
Publication Date:
April 12, 2006
Filing Date:
March 29, 2001
Export Citation:
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Assignee:
Toshiba Corporation
International Classes:
G03F7/004; H05K3/10; C23C18/18; G03F7/38; H05K1/18; H05K3/18; H05K3/46; (IPC1-7): H05K3/10; C23C18/18; G03F7/004; G03F7/38; H05K1/18; H05K3/18; H05K3/46
Domestic Patent References:
JP7207450A
JP4042231A
JP8314141A
JP7140670A
JP11218921A
Attorney, Agent or Firm:
Takehiko Suzue
Sadao Muramatsu
Atsushi Tsuboi
Ryo Hashimoto
Satoshi Kono
Makoto Nakamura
Shoji Kawai