Title:
METHOD FOR MANUFACTURING CONDUCTIVE BASE MATERIAL
Document Type and Number:
Japanese Patent JP2008171568
Kind Code:
A
Abstract:
To provide a method for manufacturing a conductive base material that enables to form a high-precision wiring pattern having excellent conductivity.
A silver image is formed on at least one face of a support by a photographic method. After that, the material formed with the silver image is irradiated with ultraviolet rays. Then, non-electrolytic plating is applied to the material.
Inventors:
ISHIKURA HIROYUKI
GOKAN HIROHIKO
GOKAN HIROHIKO
Application Number:
JP2007000684A
Publication Date:
July 24, 2008
Filing Date:
January 05, 2007
Export Citation:
Assignee:
MITSUBISHI PAPER MILLS LTD
International Classes:
H01B13/00; G03C1/00; G03C5/26; G03C8/06; H05K9/00
Domestic Patent References:
| JP2004296424A | 2004-10-21 |
Foreign References:
| WO2004007810A1 | 2004-01-22 |