Title:
METHOD FOR MANUFACTURING CONDUCTIVE PATTERN
Document Type and Number:
Japanese Patent JP2017191736
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a method for manufacturing a conductive pattern, by which a conductive pattern with favorable visibility (invisibility) is obtained and excellent productivity is achieved.SOLUTION: The method for manufacturing a conductive pattern includes at least: an exposure step of exposing a conductive pattern precursor along a desired pattern; a development step of developing the exposed conductive pattern precursor; an electroless silver plating step of subjecting the precursor to electroless plating in an electroless silver plating liquid containing a water-soluble polymer compound having an amino group; and a resist pattern removal step of removing a resist pattern.SELECTED DRAWING: None
Inventors:
AKAIWA SHOJI
Application Number:
JP2016081292A
Publication Date:
October 19, 2017
Filing Date:
April 14, 2016
Export Citation:
Assignee:
MITSUBISHI PAPER MILLS LTD
International Classes:
H01B13/00; C23C18/20; C23C18/44; H05K3/18