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Title:
METHOD OF MANUFACTURING CONSTRUCTION BOARD
Document Type and Number:
Japanese Patent JP2010194462
Kind Code:
A
Abstract:

To provide a method of manufacturing a construction board excellent in wettability of a UV ink to an undercoating material, an adhesion property between the undercoating material and UV ink images, and color reproducibility of images formed by curing the UV ink, regarding a construction board on which images are formed by inkjet printing.

The method of manufacturing a construction board involves (1) a step of forming an undercoating on a substrate, (2) a step of inkjet coating with a UV ink after the step (1), and (3) a step of curing the UV ink by UV rays after the step (2); wherein a coating material for the undercoating is an acrylic emulsion having MFT (minimum film formation temperature) of 75 to 110°C in the state that the emulsion contains no film formation-assisting agent and the UV ink contains a bifunctional reactive monomer, an aliphatic reactive oligomer, a photopolymerization initiator, and a pigment and the temperature of the substrate is 45 to 55°C in the step (2).


Inventors:
NAKADA KAZUHIRO
ITO YOSHIKATSU
Application Number:
JP2009000042635
Publication Date:
September 09, 2010
Filing Date:
February 25, 2009
Export Citation:
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Assignee:
SEIREN CO LTD
International Classes:
B05D7/00; B05D1/26; B05D3/06; B05D7/24; C09D4/00; C09D4/02; C09D5/00; C09D5/02; C09D7/12; C09D11/00; C09D11/322; C09D11/38; C09D133/00; E04F13/08
Domestic Patent References:
JP2008080629A2008-04-10
JPH04183738A1992-06-30
JP2007069416A2007-03-22
JP2006515684A2006-06-01
JP2007210167A2007-08-23
JP2006160959A2006-06-22



 
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