Title:
銅張積層板の製造方法
Document Type and Number:
Japanese Patent JP7322678
Kind Code:
B2
Abstract:
To provide a method of producing a copper-clad laminate having an intended rate of dimensional change.SOLUTION: A copper clad laminate 1 is obtained by forming a copper plating film 20 on the surface of a substrate 10 by alternately carrying out electroplating at a standard current density and electroplating at a variable current density. The rate of dimensional change of the copper clad laminate 1 is adjusted by adjusting the variable current density. By adjusting the variable current density, the copper clad laminate 1 having an intended rate of dimensional change can be produced. The productivity can be improved by only adjusting the variable current density, compared to the case when the current densities are adjusted as a whole.SELECTED DRAWING: Figure 1
Inventors:
Yoshihide Nishiyama
Application Number:
JP2019213797A
Publication Date:
August 08, 2023
Filing Date:
November 27, 2019
Export Citation:
Assignee:
Sumitomo Metal Mining Co., Ltd.
International Classes:
C25D5/18; B32B15/08; B32B37/00; C25D21/12; H05K1/03; H05K3/18
Domestic Patent References:
| JP2019167583A | ||||
| JP2019038136A | ||||
| JP2017031472A | ||||
| JP2013544952A |
Attorney, Agent or Firm:
Patent Attorney Corporation Yamauchi Patent Office
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