Title:
樹脂マスク層用洗浄剤組成物及び回路基板の製造方法
Document Type and Number:
Japanese Patent JP6412377
Kind Code:
B2
Abstract:
The present invention provides a detergent composition for resin mask layer that can reduce the residue of resin mask layer (resin film) and inhibit the generation of solder corrosion, and a manufacturing method of circuit board using the composition. In one embodiment, with the detergent composition as 100 mass%, the detergent composition used for resin mask layer in the fabrication of circuit board contains more than 0.5 mass% and less than 3.0 mass% of hydroxide quaternary ammonium (component A), more than 3.0 mass% and less than 14.0 mass% of water soluble amine (component B), more than 0.3 mass% and less than 2.5 mass% of acid or its ammonium salt (component C), and more than 50.0 mass% and less than 95.0 mass% of water (component D).
Inventors:
Mami Okamura
Jun Naganuma
Shingo Takada
Jun Naganuma
Shingo Takada
Application Number:
JP2014184510A
Publication Date:
October 24, 2018
Filing Date:
September 10, 2014
Export Citation:
Assignee:
Kao Corporation
International Classes:
G03F7/42; B08B3/08; C11D7/26; C11D7/32; C11D7/34; H01L21/60
Domestic Patent References:
| JP2011035404A | ||||
| JP2009063649A | ||||
| JP2001343759A | ||||
| JP2011502281A | ||||
| JP2009298940A | ||||
| JP10284452A | ||||
| JP2015014791A | ||||
| JP2001107098A | ||||
| JP2009075285A | ||||
| JP2011204909A | ||||
| JP2004325918A | ||||
| JP2008543060A |
Foreign References:
| US20090120457 | ||||
| WO2013021296A1 |
Attorney, Agent or Firm:
Ikeuchi, Sato & Partners