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Patent Searching and Data


Title:
METHOD OF MANUFACTURING DIELECTRIC LINE
Document Type and Number:
Japanese Patent JP2003283222
Kind Code:
A
Abstract:

To provide a method by which a dielectric line can be manufactured efficiently with high reliability and accuracy.

After a resist material 22 is formed on a green molded body 23 and through holes 8 and 9 for through conductors are formed through the molded body 23, an unburned dielectric substrate 2a is obtained by removing a prescribed portion of the molded body 23 by sandblasting in an eroding step by using the resist material 22 as a mask. At the same time, the marginal sections 12 of the opened ends of the through holes 8 and 9 and internal peripheral surfaces 13 of the holes 8 and 9 are smoothed, Subsequently, a dielectric substrate 2 having a raised section 3 and wing sections 4 and 5 respectively having the through holes 8 and 9 is obtained by performing a burning step. Thereafter, conductive films are formed on both surfaces of the substrate 2 and, at the same time, through conductors are formed in the through holes 8 and 9 so as to electrically connect the conductive films formed on both surfaces of the substrate 2 to each other.


Inventors:
TAKEDA TOSHIKAZU
Application Number:
JP2002080361A
Publication Date:
October 03, 2003
Filing Date:
March 22, 2002
Export Citation:
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Assignee:
MURATA MANUFACTURING CO
International Classes:
H01P3/123; H01P3/16; H01P11/00; (IPC1-7): H01P11/00; H01P3/123; H01P3/16
Attorney, Agent or Firm:
Masaaki Koshiba