Title:
METHOD OF MANUFACTURING ELECTRIC DEVICE
Document Type and Number:
Japanese Patent JP2003253485
Kind Code:
A
Abstract:
To provide a method of producing an electric device, in which the use amount of a plating liquid can be saved.
A photoresist layer 28 is formed on a substrate 1 so that areas (to be plated), where surface electrode parts 20 are formed, are exposed and the other areas other than the areas are covered by the photoresist. A plating liquid 30 is supplied to only each area to be plated individually by using an ink jet device 50. Then, an electric current is supplied while bringing an anode 60 into contact with each plating liquid 30. Bump parts 24 having a desired thickness can be formed by appropriately setting the energizing time.
Inventors:
KUROSAWA HIROFUMI
Application Number:
JP2002050110A
Publication Date:
September 10, 2003
Filing Date:
February 26, 2002
Export Citation:
Assignee:
SEIKO EPSON CORP
International Classes:
C25D5/02; C25D7/12; C25D21/12; H01L21/60; (IPC1-7): C25D5/02; C25D7/12; C25D21/12; H01L21/60
Attorney, Agent or Firm:
Yoshiyuki Inaba (2 outside)
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