To provide a method for manufacturing an electro-optical device for reducing a cost by avoiding an electric short circuit between pieces of wiring.
An electrode does not remain on the same potential line 40 after cutting a board even when the same potential line 40 and the electrode are formed to be partly overlaid in a region 41 including a cut line 50 of a TFD array side mother board 100, since it has a process for removing a conductive layer around the same potential line 40, namely the electrode. Thereby the electric short circuit between scanning lines 33 can be avoided, and the cost can be reduced. In addition, since a process for forming a pad part 35 and the process for removing the electrode are simultaneously performed, the electric short circuit between the scanning lines 33 can be avoided without increasing a manufacture process.
Masatake Shiga
Masakazu Aoyama