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Title:
METHOD FOR MANUFACTURING ELECTROFORMED COMPONENT
Document Type and Number:
Japanese Patent JP2012041600
Kind Code:
A
Abstract:

To stably separate an electroformed body from a resin layer while suppressing surface roughening of the electroformed body.

A method for manufacturing an electroformed component performs electroforming by using a molding die in which a resin layer 3 obtained by hardening a photosensitive material of a chemical amplification type is formed on a conductive layer of a substrate, thereby forming an electroformed body 5, then removes the substrate and the resin layer from the molding die. The method includes a first removal step of removing the substrate from the molding die, and a second removal step of removing the resin layer from the molding die. The second removal step includes a mixing step of mixing the molding die with a peeling agent 30 having sodium hydroxide 31 and potassium hydroxide 32 and not having at least one of compound containing sulfate group or nitrate group, and halogen compound, and a heating step of heating the peeling agent to a temperature of ≥150°C and ≤250°C after the mixing step, and melting the peeling agent. During the heating step, the molding die is kept immersed in the molten peeling agent.


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Inventors:
HORIKIRI KAZUYUKI
KISHI MATSUO
NIWA TAKASHI
KIKUCHI KIYOSHI
OBARA KAORU
Application Number:
JP2010183223A
Publication Date:
March 01, 2012
Filing Date:
August 18, 2010
Export Citation:
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Assignee:
MORIOKA SEIKO INSTR INC
International Classes:
C25D1/22; B08B3/08; C23G1/32
Domestic Patent References:
JP2000078929A2000-03-21
JP2007259747A2007-10-11
JP2004052050A2004-02-19
JP2003277969A2003-10-02
JP2000212790A2000-08-02
JPH0944913A1997-02-14
JPH0741983A1995-02-10
JP2007186735A2007-07-26
JPH10249270A1998-09-22
Attorney, Agent or Firm:
Kentaro Kuhara
Noriaki Uchino
Nobuyuki Kimura



 
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