To sufficiently satisfy demands for a lower cost, multikind and small quantity production, and a shorter cycle including design, manufacturing, evaluation, and correction.
In this manufacturing method, a visual image is formed on the surface of a photosensitive drum 10 with metal-containing resin particles 18 which contain conductive metal fine particles, and the visual image is brought into contact and is pressed to the surface of an intermediate transfer body drum 14 so that the visual image is transferred using the adhesion of the resin. The metal-containing resin particles 18 are pressed to the surface of the intermediate transfer body drum 14 by rotations of the photosensitive drum 10 and the intermediate transfer body drum 14, transfer is made by the adhesion of the metal-containing resin particles 18, and the metal-containing resin particles 18 are brought into contact, pressed, and transferred onto a base material 16 from the intermediate transfer body drum 14. The conductive metal fine particles contained in the metal-containing resin particles 18 act as a nucleus of electroless plating and have a catalytic function for the development of plating.
| JP2001308176 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE |
| JPH0384962 | MANUFACTURE OF SEMICONDUCTOR DEVICE |
| JP6351680 | Semiconductor device |
YAMAGUCHI NAOKO
TAKUBO TOMOAKI
IIDA ATSUKO
HOTTA YASUYUKI
