To provide a method for manufacturing an electronic component having a wiring pattern with high dimension precision by preventing a ceramic green sheet from being deformed in a manufacturing process.

This method for manufacturing an electronic component comprises a process for forming a laminate ceramic green sheet 4 by forming a second ceramic green sheet layer 3 on a first ceramic green sheet layer 2, a process for forming a constraint green sheet 7 which is not sintered in the sintering temperature of the laminate ceramic green sheet 4, a process for arranging and heating the constraint green sheet 7 on the upper and lower faces and side face of the ceramic green sheet laminate 6, and for manufacturing a raw laminate 8 where the constraint green sheet 7 is arranged on the upper and lower face and side face of the ceramic green sheet laminate 6 and a process for burning the raw laminate 8. The first ceramic green sheet layer 2 and the constraint green sheet 7 contain melting components which are put in a melting status in heating at the time of manufacturing the ceramic green sheet laminate 6 and at the time of heating the raw laminate 8.