To provide a method of manufacturing an electronic component which has excellent forming stability in formation of upper surface electrodes and connection reliability by enabling to suppress the generation of burrs or peeling in dicing an upper surface electrodes formed with a thick film.
This method is provided with a process of forming the upper surface electrodes 12 made of a thick film on the upper surface of a sheet-like insulation substrate 11; a process of sticking a first tape 19 so that at least one part of each of the upper surface electrodes 12 is covered; a process of sticking the rear surface of the insulation substrate 11 on a second tape 20; and a process of dicing a region including the upper surface electrodes 12 on which the first tape 19 is stuck in the insulation substrate 11 stuck on the second tape 20.
YAMASHITA SHOZO
SHIBUYA NAOKI
Hiroki Naito
Daisuke Nagano
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