Title:
METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP2013038429
Kind Code:
A
Abstract:
To solve the problem that both of simplicity and junction reliability should be achieved when forming a metal film by joining it to an element assembly such as ceramic, glass and resin.
A metal film comprising a porous metal plating film having many hole parts and a glass component filled in the hole parts is prepared and the metal film is heat-adhered to an element assembly.
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Inventors:
SAITO JUNICHI
KUNISHI TATSUO
KUNISHI TATSUO
Application Number:
JP2012183861A
Publication Date:
February 21, 2013
Filing Date:
August 23, 2012
Export Citation:
Assignee:
MURATA MANUFACTURING CO
International Classes:
H05K3/22; C25D1/00; C25D1/08; H05K1/09; H05K3/18; H01C17/00; H01G13/00
Domestic Patent References:
| JP2005231937A | 2005-09-02 | |||
| JPS63199878A | 1988-08-18 | |||
| JPH11204941A | 1999-07-30 |