METHOD OF MANUFACTURING ELECTRONIC DEVICE INCLUDING PROCESS OF SELECTIVELY FORMING CURED FILM

Title:

METHOD OF MANUFACTURING ELECTRONIC DEVICE INCLUDING PROCESS OF SELECTIVELY FORMING CURED FILM

Document Type and Number:

Japanese Patent JP2011018762

Kind Code:

A

Abstract:

To provide a method of manufacturing an electronic device, including a process of selectively forming a cured film, that eliminates the need for cleaning, lightens an environmental load, and can selectively form an opening on an electrode surface and protect a specified surface.

The method of manufacturing the electronic device which includes a surface and an end face substantially orthogonal to the surface and differing in surface state from the surface, and also has the cured film only on the end face includes a process of forming a coating film of a curing-moldable liquid, having a smaller angle of contact with the end face of the electronic device than with the surface connecting with the end face, only on the end face by applying the liquid in contact with at least a part of the end face, and a process of forming the cured film by curing the coating film.

Inventors:

KUCHIKI MIKIHARU
KAMIMURA TAICHI

Application Number:

JP2009162164A

Publication Date:

January 27, 2011

Filing Date:

July 08, 2009

Export Citation:

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Assignee:

KYORITSU KAGAKU SANGYO

International Classes:

H01L21/56; H01L23/00; H01L23/29; H01L23/31

Domestic Patent References:

JP2005159225A	2005-06-16
JP2008534252A	2008-08-28
JP2007266421A	2007-10-11

Attorney, Agent or Firm:

Hajime Tsukuni
Koshiro Tsukuda
Fusayuki Saito
Masatoshi Ando

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