To provide a method of manufacturing an electronic device in which burrs are removed.

The method of manufacturing the electronic device includes processes of: mounting a plurality of electronic elements 10 on an upper surface of a package 4; providing lids 2 on upper surfaces of the mounted electronic elements 10; cutting the lids 2 by dicing; and removing burrs 12 formed in the process of cutting the lids 2 by a chemical grinding method. The chemical grinding method is implemented to remove the burrs formed in the dicing process.