Title:
METHOD FOR MANUFACTURING ELECTRONIC DEVICE
Document Type and Number:
Japanese Patent JP2018151475
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a method for manufacturing an electronic device by which cracks generating after development can be suppressed from remaining.SOLUTION: The method for manufacturing an electronic device according to the present invention includes: a disposing step of disposing a photosensitive resin layer on a substrate; an exposing step of exposing the photosensitive resin layer after the disposing step; a post-exposure heating step of subjecting the photosensitive resin layer to post-exposure heating after the exposing step; a developing step of developing the photosensitive resin layer after the post-exposure heating step; and a curing step of curing the photosensitive resin layer after the developing step. The method further includes a heating step of heating the photosensitive resin layer after the developing step and prior to the curing step, and a heating temperature in the heating step is equal to or higher than a post-exposure heating temperature in the post-exposure heating step.SELECTED DRAWING: Figure 1
Inventors:
SUZUKI SAKIKO
TAKAHASHI YASUNORI
YAMAKAWA YUDAI
TAKAHASHI YASUNORI
YAMAKAWA YUDAI
Application Number:
JP2017046460A
Publication Date:
September 27, 2018
Filing Date:
March 10, 2017
Export Citation:
Assignee:
SUMITOMO BAKELITE CO
International Classes:
G03F7/38; G03F7/004; G03F7/038; G03F7/09; G03F7/20; G03F7/40; H01L21/312
Attorney, Agent or Firm:
Shinji Hayami