To provide a method for inexpensively and reliably manufacturing ferro-alloy electronic parts that are surface-treated by using a metal which is not deformed by heating, does not include lead and tin, does not form a whisker and has adequate wettability to solder.

The method for manufacturing the surface-treated electronic parts comprises the steps of: forming a three-layer structure of nickel, palladium and gold on the portion to be soldered of the parts by electrolytic plating treatment, so that the palladium layer can acquire a thickness in a range of 0.007 to 0.1 μm , the gold layer can acquire a thickness in a range of 0.003 to 0.02 μm, and both thicknesses can satisfy a relationship of: thickness of gold layer is less than thickness of palladium layer; and press-forming the base material after having formed the gold layer.