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Title:
METHOD FOR MANUFACTURING ELEMENT CHIP
Document Type and Number:
Japanese Patent JP2018056178
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a method for manufacturing an element chip forming a resist pattern on a substrate held by a holding tape and, subsequently, etching the substrate with plasma.SOLUTION: A method for manufacturing an element chip includes: a step of preparing a substrate having a first surface and a second surface opposite to the first surface and having a plurality of element regions and division regions defining the element regions, with the second surface held by a holding tape; a step of producing particles by spraying resist solution containing a resist component and a solvent; a step of forming a resist film by volatilizing the solvent from the particles and, subsequently, depositing the resist component on the first surface of the substrate held by the holding tape; a patterning step of patterning the resist film and exposing the division regions on the first surface of the substrate; and a step of etching the division regions from the first surface with plasma.SELECTED DRAWING: Figure 3

Inventors:
MATSUBARA ISAYUKI
Application Number:
JP2016187024A
Publication Date:
April 05, 2018
Filing Date:
September 26, 2016
Export Citation:
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Assignee:
PANASONIC IP MANAGEMENT CORP
International Classes:
H01L21/027; G03F7/26; H01L21/301; H01L21/3065
Domestic Patent References:
JP2007156465A2007-06-21
JP2003297725A2003-10-17
JP2012235130A2012-11-29
JP2007019385A2007-01-25
JP2015201562A2015-11-12
JP2014230185A2014-12-08
JP2002527795A2002-08-27
Foreign References:
US20150255349A12015-09-10
US20150221505A12015-08-06
Attorney, Agent or Firm:
河崎 眞一
津村 祐子