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Patent Searching and Data


Title:
METHOD FOR MANUFACTURING EMI SUPPRESSING CABLE
Document Type and Number:
Japanese Patent JP2004206953
Kind Code:
A
Abstract:

To provide a method for manufacturing an EMI suppressing cable which improves an EMI noise suppressing function, reliability and durability.

In the method for manufacturing an EMI suppressing cable 15 for forming a sheath layer 14 outside a ferrite compound mixed resin layer 12 to coat the cable 15, after forming to coat a shield layer 11 on the outer periphery of a core wire bundle with an insulating coated layer and forming to coat a ferrite compound mixture resin layer 12 on the outer periphery of the shield layer 11, it is characterized that the shield layer 11 is formed in a metal braid wire layer, a metal tape layer or a mesh metal wire mixture resin layer to coat the shield layer 11, and furthermore the resin layer 12 is formed on a ferrite compound mixture resin tape by adjusting the mixture ratio of ferrite particles to mix them into the resin, then the outer periphery of the shield layer 11 is coated by the resin tape.


Inventors:
TSUTSUI NORITAKA
NAKADA TOMONORI
Application Number:
JP2002372782A
Publication Date:
July 22, 2004
Filing Date:
December 24, 2002
Export Citation:
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Assignee:
MITSUMI ELECTRIC CO LTD
International Classes:
H01B13/22; (IPC1-7): H01B13/22
Attorney, Agent or Firm:
Takakichi Hayashi