To provide an efficient and economical means to manufacture a field emitter tip within a laminated substrate.

The laminated substrate is pattern-molded, by using a standard photograph flat-plate technology and etching is applied, and a rectangular or a columnar column is formed on the upper part of the substrate, composed of conductive layer(s) and non-conducive layer(s). Next, the laminated substrate is exposed to an anisotropic etching medium. This anisotropic etching medium is one which is for removing its column, in order to generate a well (504) to penetrate the conductive layer(s) and the non-conductive layer(s) (204, 206, 208, 210) and for forming a conical or a pyramidal field emitter tip (506), in a silicon substrate immediately below the well (504). Lastly, a dielectric material is removed from a wall of the well, by using retreating etching. At an optional step, a thin metal coating can be sputtered on the surface of the silicon-based electric field emitter tip.