Title:
基材フィルム付き導電構造体含有フィルムの製造方法
Document Type and Number:
Japanese Patent JP7196070
Kind Code:
B2
Abstract:
The present invention relates to a production method of a conductive structure-containing film with a substrate film, the production method comprising:a step (1) of forming a resin layer (X) by coating a thermoplastic resin composition (A) containing at least one thermoplastic resin selected from the group consisting of a polyvinyl acetal resin, an ionomer resin, and an ethylene-vinyl acetate copolymer resin on one side of a substrate film; anda step (2) of forming a conductive structure on the resin layer (X).
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Inventors:
Koichiro Isogami
Hirotaka Yasuda
Hirotaka Yasuda
Application Number:
JP2019527984A
Publication Date:
December 26, 2022
Filing Date:
July 06, 2018
Export Citation:
Assignee:
Kuraray Europe GmbH
International Classes:
C03C27/12; B32B15/08; H05B3/20; H05B3/86
Domestic Patent References:
| JP11163587A | ||||
| JP63195150A | ||||
| JP2017505505A | ||||
| JP2016539905A | ||||
| JP2015513487A |
Foreign References:
| WO2016080406A1 |
Attorney, Agent or Firm:
Yamato Kento
Kenichi Morizumi
Kenichi Morizumi
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