To provide a manufacturing method by which a line width reduction and disconnection of a side face line due to dissolution into solder in a filter chip can be prevented.

A manufacturing method of a filter chip 1 has a process (S7 and S10) of printing and drying a side face line, and a process (S8 and S11) of burning the side face line. The process (S7 and S10) of printing and drying the side face line is repeated a plurality of times, and the process (S8 and S11) of burning the side face line is executed after laminating silver pastes 15A and 15B.