To provide a method of manufacturing a heat pipe by which heat treatment for soldering can be carried out while a pipe intermediate body is stood.
When fins 5 are connected to the outer peripheral surface of a pipe body 3 by solder, a restraint jig 10 for mechanically restricting a plurality of fins is fixed to the pipe body 3 and a heat treatment for soldering is performed. The plurality of restraint jigs 10 are fixed along an axial direction, each of the restraint jigs 10 being comprised of a first jig 11 and a second jig 15. The first jig 11 has a ring-shape in which a first tapered surface is formed in the inner peripheral surface thereof. The second jig 15 has a ring-like shape in which a second tapered surface 16 adapted for the first tapered surface 12 is formed in the outer peripheral surface of the second jig and a partial peripheral portion thereof is cut. When the restraint jig 10 restrains the fins 5, the second jig is fitted to the first jig in such a way that the first tapered surface 12 and the second tapered surface 16 come in contact with each other.
MIZUTA KEIJI
FUJITANI YASUYUKI
SUZUTA TADAHIKO
| JPS5877278U | 1983-05-25 | |||
| JPS422724B1 | ||||
| JPS4818649A | ||||
| JPS60256622A | 1985-12-18 | |||
| JPS6325808U | 1988-02-20 | |||
| JPS5084880A | 1975-07-09 | |||
| JPH0144953Y2 | 1989-12-26 |
Horikawa Miyuki