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Title:
METHOD OF MANUFACTURING GLASS SUBSTRATE WITH THROUGH ELECTRODE AND METHOD OF MANUFACTURING ELECTRONIC COMPONENTS
Document Type and Number:
Japanese Patent JP2012019106
Kind Code:
A
Abstract:

To improve flatness of a glass substrate 3 where a plurality of through electrodes 7 are formed.

A method of manufacturing a glass substrate with a through electrode comprises: a through hole forming step S1 for forming a plurality of through holes 4 for electrodes and a plurality of dummy through holes 5 on a plate-like glass 1; an electrode insertion step S2 for inserting an electrode member 6 into the through hole 4 for electrodes; a welding sep S3 for heating the plate-like glass 1 to a temperature higher than its softening point and welding the plate-like glass 1 and the electrode member 6; and a grinding sep S4 for forming a plurality of through electrodes 7 that are mutually and electrically separated by exposing the electrode member 6 to both surfaces of the plate-like glass 1 by grinding both surfaces of the plate-like glass 1 together with the electrode member 6.


Inventors:
Kawai, Noboru
Application Number:
JP2010000156170
Publication Date:
January 26, 2012
Filing Date:
July 08, 2010
Export Citation:
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Assignee:
SEIKO INSTRUMENTS INC
International Classes:
H01L23/15; H01L23/08; H03H3/02; H03H9/02